The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2015

Filed:

Aug. 25, 2011
Applicants:

Genshu Fuse, Tokyo, JP;

Michiro Sugitani, Tokyo, JP;

Inventors:

Genshu Fuse, Tokyo, JP;

Michiro Sugitani, Tokyo, JP;

Assignee:

Sen Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/04 (2006.01); H01L 21/425 (2006.01); H01L 21/265 (2006.01); H01L 29/66 (2006.01); H01L 21/223 (2006.01);
U.S. Cl.
CPC ...
H01L 21/26526 (2013.01); H01L 21/2236 (2013.01); H01L 21/26586 (2013.01); H01L 29/66803 (2013.01);
Abstract

After formation of a silicon Fin part on a silicon substrate, a thin film including an impurity atom which becomes a donor or an acceptor is formed so that a thickness of the thin film formed on the surface of an upper flat portion of the silicon Fin part becomes large relative to a thickness of the thin film formed to the surface of side wall portions of the silicon Fin part. A first diagonal ion implantation from a diagonal upper direction to the thin film is performed and subsequently a second diagonal ion implantation is performed from an opposite diagonal upper direction to the thin film. Recoiling of the impurity atom from the inside of the thin film to the inside of the side wall portions and to the inside of the upper flat portion is realized by performing the first and second diagonal ion implantations.


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