The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2015
Filed:
Aug. 29, 2013
Applicant:
Intermolecular, Inc., San Jose, CA (US);
Inventors:
Bob Kong, Newark, CA (US);
Igor Ivanov, Danville, CA (US);
Zhi-Wen Sun, Sunnyvale, CA (US);
Jinhong Tong, Santa Clara, CA (US);
Assignee:
Intermolecular, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/44 (2006.01); H01L 21/02 (2006.01); H01L 21/033 (2006.01); H01L 21/288 (2006.01); H01L 21/3105 (2006.01); H01L 21/768 (2006.01); C23C 18/18 (2006.01); C23C 18/16 (2006.01); H01L 27/105 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
C23C 18/44 (2013.01); Y10T 428/24917 (2015.01); Y10T 428/12493 (2015.01); Y10T 428/12903 (2015.01); Y10T 428/12875 (2015.01); H01L 21/02068 (2013.01); H01L 21/0332 (2013.01); H01L 21/288 (2013.01); H01L 21/3105 (2013.01); H01L 21/76814 (2013.01); H01L 21/76849 (2013.01); H01L 21/7687 (2013.01); H01L 28/65 (2013.01); C23C 18/1844 (2013.01); C23C 18/1605 (2013.01); C23C 18/1607 (2013.01); C23C 18/1637 (2013.01); H01L 27/1052 (2013.01);
Abstract
Embodiments of the current invention describe a method of plating platinum selectively on a copper film using a self-initiated electroless process. In particular, platinum films are plated onto very thin copper films having a thickness of less than 300 angstroms. The electroless plating solution and the resulting structure are also described. This process has applications in the semiconductor processing of logic devices, memory devices, and photovoltaic devices.