The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2015
Filed:
Dec. 29, 2011
Aaron Cadag, Calamba, PH;
Berniechrisanto Ang, Bantangas, PH;
Richard Laylo, Calamba, PH;
STMicroelectronics, Inc., Calamba, Laguna, PH;
Abstract
A device and method for manufacturing integrated circuit packaging using a mold plunger with position compensation in a manufacturing setting. In an embodiment, a compensating mold plunger, which may be used during the manufacture of an integrated circuit package, engages a die set on a carrier and within a bushing. This may be done to inject a mold compound on top of the die/carrier. If the bushing that is housing the die/carrier tandem is misaligned with the plunger in any lateral direction, the amount of pressure may be compromised. A compensating mold plunger includes a flexible portion that allows for the head of the plunger to properly engage the die/carrier despite any possible misalignments. Further, different die/carrier combinations may also be used with a compensating mold plunger because the pressure and force applied may be uniform inside a bushing despite the contents of the bushing.