The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2015

Filed:

Nov. 16, 2012
Applicant:

Vishay General Semiconductor Llc, Hauppauge, NY (US);

Inventors:

Chih Wei Hsu, Taipei, TW;

Max Chen, Taipei Hsien, TW;

Assignee:

Vishay General Semiconductor LLC, Hauppauge, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/872 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/8725 (2013.01); H01L 29/6606 (2013.01); H01L 29/0623 (2013.01);
Abstract

A semiconductor device includes a semiconductor substrate having a first type of conductivity. A first layer is formed on the substrate having the first type of conductivity and is more lightly doped than the substrate. At least one trench is formed in the first layer. A dielectric layer lines the bottom surface and the sidewalls of the trench. A conducting material fills the trench. A lightly doped region is formed in the first layer having the second conductivity type. The lightly doped region is disposed below the bottom surface of the trench. A metal layer is disposed over the first layer and the conducting material. A first electrode is formed over the metal layer and a second electrode is formed on a backside of the substrate.


Find Patent Forward Citations

Loading…