The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Jun. 21, 2012
Applicants:

Michio Horiuchi, Nagano, JP;

Yasue Tokutake, Nagano, JP;

Yuichi Matsuda, Nagano, JP;

Tomoo Yamasaki, Nagano, JP;

Inventors:

Michio Horiuchi, Nagano, JP;

Yasue Tokutake, Nagano, JP;

Yuichi Matsuda, Nagano, JP;

Tomoo Yamasaki, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 21/486 (2013.01); H05K 3/4602 (2013.01); H05K 2201/10378 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 21/4857 (2013.01); H01L 2924/0002 (2013.01);
Abstract

One embodiment provides a wiring substrate including: a core substrate having an insulative base member, the insulative base member having a first surface and a second surface, a plurality of linear conductors penetrating through the insulative base member from the first surface to the second surface; an inorganic material layer joined to at least one of the first surface and the second surface of the insulative base member; and a penetration line penetrating through the inorganic material layer, wherein one end of the penetration line is electrically connected to a corresponding part of the linear conductors, without intervention of a bump.


Find Patent Forward Citations

Loading…