The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Nov. 08, 2013
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Chien-Ying Sun, Tainan, TW;

En-Chiuan Liou, Tainan, TW;

Jia-Rong Wu, Kaohsiung, TW;

Ching-Wen Hung, Tainan, TW;

Assignee:

United Microelectronics Corp., Science-Based Industrial Park, Hsin-Chu, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/306 (2006.01); H01L 21/8234 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30604 (2013.01); H01L 21/823431 (2013.01); H01L 21/3083 (2013.01);
Abstract

A method for fabricating a patterned structure of a semiconductor device includes: forming first mandrels and second mandrels on a substrate, wherein a first spacing is defined between the two adjacent first mandrels and a second spacing is defined between the two adjacent second mandrels, the first spacing being wider than the second spacing; forming a cover layer to cover the first mandrels while exposing the second mandrels; etching the cover layer and the second mandrels; removing the cover layer; concurrently forming first spacers on the sides of the first mandrels and a second spacers on the sides of the second mandrels after removing the cover layer; and transferring a layout of the first and second spacers to the substrate so as to form fin-shaped structures.


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