The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Jan. 10, 2013
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Masumi Saitoh, Kanagawa-ken, JP;

Toshinori Numata, Kanagawa-ken, JP;

Kiwamu Sakuma, Kanagawa-ken, JP;

Haruka Kusai, Kanagawa-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/792 (2006.01); H01L 21/70 (2006.01); H01L 29/78 (2006.01); H01L 21/265 (2006.01); H01L 29/775 (2006.01); H01L 29/788 (2006.01); H01L 27/12 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 27/115 (2006.01); B82Y 10/00 (2011.01); H01L 29/45 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78 (2013.01); H01L 21/265 (2013.01); H01L 29/775 (2013.01); H01L 29/785 (2013.01); H01L 29/7881 (2013.01); H01L 29/792 (2013.01); H01L 27/1203 (2013.01); H01L 27/1211 (2013.01); H01L 29/0653 (2013.01); H01L 29/1033 (2013.01); H01L 27/11534 (2013.01); H01L 27/11573 (2013.01); B82Y 10/00 (2013.01); H01L 29/458 (2013.01); H01L 29/0673 (2013.01);
Abstract

According to one embodiment, a semiconductor device includes a substrate and a first transistor. The substrate has a major surface. The first transistor is provided on the major surface. The first transistor includes a first stacked body, first and second conductive sections, a first gate electrode, and a first gate insulating film. The first stacked body includes first semiconductor layers and first insulating layers alternately stacked. The first semiconductor layers have a side surface. The first conductive section is electrically connected to one of the first semiconductor layers. The second conductive section is apart from the first conductive section and electrically connected to the one of the first semiconductor layers. The first gate electrode is provided between the first and second conductive sections and opposed to the side surface. The first gate insulating film is provided between the first gate electrode and the first semiconductor layers.


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