The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Jul. 09, 2010
Applicants:

Weilin Gao, Tokyo, JP;

Akira Sugawara, Tokyo, JP;

Ryosuke Miyahara, Tokyo, JP;

Hisashi Suda, Tokyo, JP;

Inventors:

Weilin Gao, Tokyo, JP;

Akira Sugawara, Tokyo, JP;

Ryosuke Miyahara, Tokyo, JP;

Hisashi Suda, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/02 (2006.01); C22C 9/04 (2006.01); C22C 9/06 (2006.01); C22F 1/08 (2006.01); C22C 9/10 (2006.01);
U.S. Cl.
CPC ...
C22C 9/06 (2013.01); C22C 9/10 (2013.01); C22F 1/08 (2013.01);
Abstract

There is provided a copper alloy sheet including 1.0 to 3.5 mass % Ni, 0.5 to 2.0 mass % Co, and 0.3 to 1.5 mass % Si, a Co/Ni mass ratio being 0.15 to 1.5, an (Ni+Co)/Si mass ratio being 4 to 7, and a balance being composed of Cu and an unavoidable impurity, wherein in observation results of a crystal grain boundary property and crystal orientation by EBSP measurement, a density of twin boundaries among all crystal grain boundaries is 40% or more and an area ratio of crystal grains with Cube orientation is 20% or more, on a rolled surface.


Find Patent Forward Citations

Loading…