The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2015
Filed:
Sep. 22, 2011
Unryu Ogawa, Toyama, JP;
Masahisa Okuno, Toyama, JP;
Tokunobu Akao, Toyama, JP;
Shinji Yashima, Toyama, JP;
Atsushi Umekawa, Toyama, JP;
Kaichiro Minami, Toyama, JP;
Unryu Ogawa, Toyama, JP;
Masahisa Okuno, Toyama, JP;
Tokunobu Akao, Toyama, JP;
Shinji Yashima, Toyama, JP;
Atsushi Umekawa, Toyama, JP;
Kaichiro Minami, Toyama, JP;
Hitachi Kokusai Electric Inc., Tokyo, JP;
Abstract
Provided are a substrate processing apparatus and a method of manufacturing a semiconductor device that are capable of uniformly heating a substrate while reducing an increase in substrate temperature to reduce a thermal budget. The substrate processing apparatus includes a process chamber configured to process a substrate; a substrate support unit installed in the process chamber to support the substrate; a microwave supply unit configured to supply a microwave toward a process surface of the substrate supported by the substrate support unit, the microwave supply unit including a microwave radiating unit radiating the microwave supplied from a microwave source to the process chamber while rotating; a partition installed between the microwave supply unit and the substrate support unit; a cooling unit installed at the substrate support unit; and a control unit configured to control at least the substrate support unit, the microwave supply unit and the cooling unit.