The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2015

Filed:

Sep. 12, 2012
Applicants:

Suguru Enokida, Koshi, JP;

Masahiro Nakaharada, Koshi, JP;

Akira Miyata, Koshi, JP;

Hidekazu Kiyama, Koshi, JP;

Naruaki Iida, Koshi, JP;

Inventors:

Suguru Enokida, Koshi, JP;

Masahiro Nakaharada, Koshi, JP;

Akira Miyata, Koshi, JP;

Hidekazu Kiyama, Koshi, JP;

Naruaki Iida, Koshi, JP;

Assignee:

Tokyo Electron Limited, Minato-Ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/677 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67178 (2013.01); H01L 21/67745 (2013.01); H01L 21/67766 (2013.01); H01L 21/67769 (2013.01); H01L 21/67781 (2013.01); H01L 21/68707 (2013.01); Y10S 414/137 (2013.01); Y10S 414/139 (2013.01);
Abstract

A substrate processing apparatus includes: a carrier block including first and second carrier placement units spaced apart in a right and left direction; a processing block having a layered structure in which a plurality of layered parts are vertically arranged, the layered parts each including a substrate transport mechanism for transporting a substrate and a processing module for processing a substrate; a tower unit including plural substrate placement units located at height positions where a substrate is transferred by the substrate transport mechanism of the layered part corresponding to the substrate placement unit; a first substrate transfer mechanism configured to transfer a substrate between the carrier on the first carrier placement unit and the substrate placement unit of the tower unit; and a second substrate transfer mechanism configured to transfer a substrate between the carrier on the second substrate placement unit and the substrate placement unit of the tower unit.


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