The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2015

Filed:

Jun. 23, 2010
Applicants:

Hironobu Miyamoto, Minato-ku, JP;

Yasuhiro Okamoto, Minato-ku, JP;

Yuji Ando, Minato-ku, JP;

Tatsuo Nakayama, Minato-ku, JP;

Takashi Inoue, Minato-ku, JP;

Kazuki Ota, Minato-ku, JP;

Kazuomi Endo, Minato-ku, JP;

Inventors:

Hironobu Miyamoto, Minato-ku, JP;

Yasuhiro Okamoto, Minato-ku, JP;

Yuji Ando, Minato-ku, JP;

Tatsuo Nakayama, Minato-ku, JP;

Takashi Inoue, Minato-ku, JP;

Kazuki Ota, Minato-ku, JP;

Kazuomi Endo, Minato-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/812 (2006.01); H01L 29/201 (2006.01); H01L 29/78 (2006.01); H01L 29/06 (2006.01); H01L 29/20 (2006.01); H01L 29/205 (2006.01); H01L 29/417 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 29/8122 (2013.01); H01L 29/201 (2013.01); H01L 29/7809 (2013.01); H01L 29/7812 (2013.01); H01L 29/7813 (2013.01); H01L 29/8128 (2013.01); H01L 29/0657 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/41741 (2013.01); H01L 29/41766 (2013.01); H01L 29/4236 (2013.01);
Abstract

Provided is a semiconductor device in which the trade-off between the withstand voltage and the on-resistance is improved and the performance is increased. A semiconductor device comprises a substrate, a first n-type semiconductor layer', a second n-type semiconductor layer, a p-type semiconductor layer, and a third n-type semiconductor layer′, wherein the first n-type semiconductor layer′, the second n-type semiconductor layer, the p-type semiconductor layer, and the third n-type semiconductor layer′ are laminated at the upper side of the substratein this order. The drain electrodeis in ohmic-contact with the first n-type semiconductor layer′ and the source electrodeis in ohmic-contact with the third n-type semiconductor layer′. A gate electrodeis arranged so as to fill an opening portion to be filled that extends from the third n-type semiconductor layer′ to the second n-type semiconductor layer, and the gate electrodeis in contact with the upper surface of the second n-type semiconductor layer, the side surfaces of the p-type semiconductor layer, and the side surfaces of the third n-type semiconductor layer′. The second n-type semiconductor layerhas composition that changes from the drain electrodeside toward the source electrodeside in the direction perpendicular to the plane of the substrateand contains donor impurity.


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