The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2015

Filed:

Oct. 03, 2014
Applicant:

Maxchip Electronics Corp., Hsinchu, TW;

Inventors:

Chen-Chiu Hsu, Hsinchu, TW;

Tung-Ming Lai, Hsinchu, TW;

Kai-An Hsueh, Miaoli County, TW;

Ming-De Huang, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/84 (2006.01); H01L 29/78 (2006.01); H01L 29/76 (2006.01); H01L 29/66 (2006.01); H01L 49/02 (2006.01); H01L 27/115 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66825 (2013.01); H01L 28/20 (2013.01); H01L 27/11517 (2013.01);
Abstract

A method of forming a semiconductor structure is provided. A substrate having a cell area and a periphery area is provided. A stacked structure including a gate oxide layer, a floating gate and a first spacer is formed on the substrate in the cell area and a resistor is formed on the substrate in the periphery area. At least two doped regions are formed in the substrate beside the stacked structure. A dielectric material layer and a conductive material layer are sequentially formed on the substrate. A patterned photoresist layer is formed on the substrate to cover the stacked structure and a portion of the resistor. The dielectric material layer and the conductive material layer not covered by the patterned photoresist layer are removed, so as to form an inter-gate dielectric layer and a control gate on the stacked structure, and simultaneously form a salicide block layer on the resistor.


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