The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2015

Filed:

Aug. 12, 2010
Applicants:

Paul Lukas Brillhart, Pleasanton, CA (US);

Richard Fovell, San Jose, CA (US);

Hamid Tavassoli, Cupertino, CA (US);

Douglas A. Buchberger, Jr., Livermore, CA (US);

Douglas H. Burns, Saratoga, CA (US);

Kallol Bera, San Jose, CA (US);

Daniel J. Hoffman, Saratoga, CA (US);

Kenneth W. Cowans, Fullerton, CA (US);

William W. Cowans, Fullterton, CA (US);

Glenn W. Zubillaga, Canyon Lake, CA (US);

Isaac Millan, Anaheim, CA (US);

Inventors:

Paul Lukas Brillhart, Pleasanton, CA (US);

Richard Fovell, San Jose, CA (US);

Hamid Tavassoli, Cupertino, CA (US);

Douglas A. Buchberger, Jr., Livermore, CA (US);

Douglas H. Burns, Saratoga, CA (US);

Kallol Bera, San Jose, CA (US);

Daniel J. Hoffman, Saratoga, CA (US);

Kenneth W. Cowans, Fullerton, CA (US);

William W. Cowans, Fullterton, CA (US);

Glenn W. Zubillaga, Canyon Lake, CA (US);

Isaac Millan, Anaheim, CA (US);

Assignee:

BE Aerospace, Inc., Wellington, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01J 37/32 (2006.01); F25B 49/02 (2006.01); C23C 16/46 (2006.01); C23C 16/50 (2006.01); C23C 16/503 (2006.01); C23C 16/52 (2006.01); H01L 21/3065 (2006.01); H05H 1/46 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67248 (2013.01); H01L 21/67069 (2013.01); H01L 21/67109 (2013.01); H01L 21/6831 (2013.01); H01J 37/32091 (2013.01); H01J 37/32724 (2013.01); H01J 2237/2001 (2013.01); H01J 37/32183 (2013.01); H05H 2001/4682 (2013.01); F25B 49/02 (2013.01); F25B 2400/0401 (2013.01); F25B 2400/0403 (2013.01); F25B 2400/0411 (2013.01); F25B 2700/21174 (2013.01); F25B 2700/21175 (2013.01);
Abstract

A plasma reactor having a reactor chamber and an electrostatic chuck having a surface for holding a workpiece inside the chamber includes inner and outer zone backside gas pressure sources coupled to the electrostatic chuck for applying a thermally conductive gas under respective pressures to respective inner and outer zones of a workpiece-surface interface formed whenever a workpiece is held on the surface, and inner and outer evaporators inside respective inner and outer zones of the electrostatic chuck and a refrigeration loop having respective inner and cuter expansion valves for controlling flow of coolant through the inner and outer evaporators respectively. The reactor further includes inner and outer zone temperature sensors in inner and outer zones of the electrostatic chuck and a thermal model capable of simulating heat transfer through the inner and outer zones, respectively, between the evaporator and the surface based upon measurements from the inner and outer temperature sensors, respectively. Inner and outer zone agile control processors coupled to the thermal model govern the inner and outer zone backside gas pressure sources, respectively, in response to predictions from the model of changes in the respective pressures that would bring the temperatures measured by the inner and outer zone sensors, respectively, closer to a desired temperature.


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