The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2015
Filed:
Sep. 20, 2011
Applicants:
Kohsuke Tsuchiya, Kiyosu, JP;
Shuhei Takahashi, Kiyosu, JP;
Inventors:
Kohsuke Tsuchiya, Kiyosu, JP;
Shuhei Takahashi, Kiyosu, JP;
Assignee:
Fujimi Incorporated, Kiyosu-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 13/06 (2006.01); H01L 21/302 (2006.01); C09K 13/00 (2006.01); B24B 37/04 (2012.01); C09G 1/02 (2006.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01); C09K 3/14 (2006.01);
U.S. Cl.
CPC ...
C09K 13/00 (2013.01); B24B 37/044 (2013.01); C09G 1/02 (2013.01); H01L 21/02024 (2013.01); H01L 21/02052 (2013.01); H01L 21/30625 (2013.01); C09K 3/1463 (2013.01);
Abstract
A polishing composition for a silicon wafer and a rinsing composition for a silicon wafer according to the present invention contain a nonionic surfactant of a polyoxyethylene adduct. The HLB value of the polyoxyethylene adduct is 8 to 15. The weight-average molecular weight of the polyoxyethylene adduct is 1400 or less. The average number of moles of oxyethylene added in the polyoxyethylene adduct is 13 or less. The content of the polyoxyethylene adduct in each of the polishing composition and the rinsing composition is 0.00001 to 0.1% by mass.