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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8970027 B1

PDFFull Text
Date of Patent:
Mar. 03, 2015

Filed:

Aug. 10, 2013

Metallization mixtures and electronic devices

Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Artur Kolics, Fremont, CA (US);

Fritz Redeker, Fremont, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:

Beyer Law Group LLP

Primary Examiner:

Trung Q Dang

Int. Cl.
CPC ...
H01L 23/04 (2006.01); H05K 1/09 (2006.01); H01L 21/288 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01); C23C 18/18 (2006.01); C25D 7/12 (2006.01); C25D 3/12 (2006.01); C25D 3/20 (2006.01); C25D 3/22 (2006.01); C25D 3/30 (2006.01); C25D 3/38 (2006.01); C25D 3/46 (2006.01); C25D 3/48 (2006.01); C25D 3/50 (2006.01); C25D 3/54 (2006.01); C25D 3/56 (2006.01); C25D 5/02 (2006.01); C25D 15/00 (2006.01); C23C 18/16 (2006.01); C23C 18/31 (2006.01); C23C 18/40 (2006.01); C23C 18/50 (2006.01); C23C 18/52 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); H01L 21/288 (2013.01); H01L 21/2885 (2013.01); H01L 21/76877 (2013.01); H01L 21/76898 (2013.01); H01L 23/53209 (2013.01); H01L 23/53238 (2013.01); H01L 23/53252 (2013.01); H01L 23/53266 (2013.01); C23C 18/1844 (2013.01); C25D 7/123 (2013.01); C25D 3/12 (2013.01); C25D 3/20 (2013.01); C25D 3/22 (2013.01); C25D 3/30 (2013.01); C25D 3/38 (2013.01); C25D 3/46 (2013.01); C25D 3/48 (2013.01); C25D 3/50 (2013.01); C25D 3/54 (2013.01); C25D 3/562 (2013.01); C25D 5/02 (2013.01); C25D 15/00 (2013.01); C23C 18/1607 (2013.01); C23C 18/1662 (2013.01); C23C 18/1834 (2013.01); C23C 18/31 (2013.01); C23C 18/40 (2013.01); C23C 18/50 (2013.01); C23C 18/52 (2013.01);
Abstract

One aspect of the present invention is a method of processing a substrate. In one embodiment, the method comprises forming an electrical conductor on or in the substrate by providing a mixture comprising metal particles and an electroless deposition solution and electrolessly depositing a metal matrix and co-depositing the metal particles. In another embodiment, the method comprises forming an electrical conductor on or in the substrate by providing a mixture comprising metal particles and an electrochemical plating solution and electrochemically plating a metal matrix and co-depositing the metal particles. Another aspect of the present invention is a mixture for the formation of an electrical conductor on or in a substrate. Another aspect of the present invention is an electronic device.

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