Temperature adjusting mechanism and semiconductor manufacturing apparatus using temperature adjusting mechanism

Abstract

Provided is a temperature adjusting mechanism, which can keep deviation of a temperature of a portion in contact with the temperature adjusting mechanism to be small by controlling the temperature accurately at a high speed. A semiconductor manufacturing apparatus using such temperature adjusting mechanism is also provided. A cooling jacket () is provided with a cooling channel (), and a heat lane (). The heat lane () is provided with a heat receiving section (), and a heat dissipating section (), and seals a two-phase condensable working fluid (hereinafter referred to as the working liquid) in an annular narrow tube alternately folds back and forth therebetween. The heat dissipating section () is a portion to be cooled by the cooling channel (), and the heat receiving section () is a portion having a temperature higher than that of the heat dissipating section (). In the heat receiving section (), heat is received, the working liquid is self-excited by nucleate boiling, and the working liquid transfers sensible heat while being circulated. Furthermore, in the heat receiving section (), a liquid phase absorbs heat and the phase is transformed into a vapor phase, and in the heat dissipating section (), a vapor phase dissipates heat and is cooled and condensed, the phase is transformed into a liquid phase, and latent heat is transferred by vapor-liquid phase transformation. Heat is transferred between the heat receiving section () and the heat dissipating section (), and the temperature is uniformized in a short time.