The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
Apr. 28, 2012
Hui Chen, Burlingame, CA (US);
Allen L. D'ambra, Burlingame, CA (US);
Jim Atkinson, Los Gatos, CA (US);
Hung Chen, Sunnyvale, CA (US);
Hui Chen, Burlingame, CA (US);
Allen L. D'Ambra, Burlingame, CA (US);
Jim Atkinson, Los Gatos, CA (US);
Hung Chen, Sunnyvale, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
The present invention provides methods and apparatus for a pre-CMP semiconductor substrate buffing module. The invention includes a polishing pad assembly adapted to be rotated against a major surface of a substrate; a chuck adapted to hold the substrate and to rotate the substrate against the polishing pad assembly as the polishing pad assembly is rotated; and a lateral motion motor adapted to oscillate the polishing pad assembly laterally across the major surface of the substrate while the polishing pad assembly is rotated against the rotating substrate. Numerous additional features are disclosed.