The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2015
Filed:
Sep. 29, 2010
Applicant:
Arthur Paul Riaf, Gloucester, MA (US);
Inventor:
Arthur Paul Riaf, Gloucester, MA (US);
Assignee:
Varian Semiconductor Equipment Associates, Gloucester, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 21/76 (2006.01); H01L 21/30 (2006.01); H01L 21/46 (2006.01); H01L 21/00 (2006.01); H01L 21/425 (2006.01); B44C 1/22 (2006.01); C03C 15/00 (2006.01); C23F 1/00 (2006.01); B01D 59/44 (2006.01); H01J 49/00 (2006.01); A61N 5/00 (2006.01); G21G 5/00 (2006.01); G21K 5/10 (2006.01); H01J 37/08 (2006.01); H01L 21/673 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67346 (2013.01); H01L 21/6836 (2013.01);
Abstract
A semiconductor wafer assembly formed by bonding a support wafer to a thin wafer using a double-sided bonding release tape. The support wafer provides support for the thin target wafer such that existing handling tools can accommodate transporting and processing the assembly without compromising the profile of the thin target wafer.