The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2015

Filed:

Jul. 26, 2012
Applicants:

Toshiki Furutani, Ogaki, JP;

Yukinobu Mikado, Ogaki, JP;

Shunsuke Sakai, Ogaki, JP;

Yusuke Tanaka, Ogaki, JP;

Inventors:

Toshiki Furutani, Ogaki, JP;

Yukinobu Mikado, Ogaki, JP;

Shunsuke Sakai, Ogaki, JP;

Yusuke Tanaka, Ogaki, JP;

Assignee:

Ibiden Co., Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/162 (2013.01); H05K 1/185 (2013.01); H05K 1/0231 (2013.01); H05K 3/4661 (2013.01);
Abstract

A printed wiring board includes a substrate having an accommodation section having multiple opening portions, multiple electronic components accommodated in the opening portions, respectively, a filler resin provided in the opening portions in the substrate such that the electronic components are secured in the opening portions in the substrate, a resin insulation layer formed over the substrate and the electronic components, a conductive layer formed on the resin insulation layer, and via conductors formed in the resin insulation layer and connecting the conductive layer and the electronic components. The opening portions are connected to each other.


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