The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8956886 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 17, 2015

Filed:

Mar. 11, 2014
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Samer Banna, San Jose, CA (US);

Olivier Joubert, Meylan, FR;

Lei Lian, Fremont, CA (US);

Maxime Darnon, Gières, FR;

Nicolas Posseme, Carantec, FR;

Laurent Vallier, Montbonnot St Martin, FR;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/66 (2006.01); H01L 21/311 (2006.01); H01L 21/027 (2006.01); H01L 21/67 (2006.01); H01L 21/308 (2006.01); H01L 21/3213 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
H01L 22/26 (2013.01); H01L 21/31144 (2013.01); H01L 21/0273 (2013.01); H01L 21/67253 (2013.01); H01L 21/3086 (2013.01); H01L 22/20 (2013.01); H01L 21/32139 (2013.01); G03F 7/70625 (2013.01);
Abstract

In some embodiments, a method of controlling a photoresist trimming process in a semiconductor manufacturing process may include forming a photoresist layer atop a first surface of a substrate, wherein the photoresist layer comprises a lower layer having a first pattern to be etched into the first surface of the substrate, and an upper layer having a second pattern that is not etched into the first surface of the substrate; trimming the photoresist layer in a direction parallel to the first surface of the substrate; measuring a trim rate of the second pattern using an optical measuring tool during the trimming process; and correlating the trim rate of the second pattern to a trim rate of the first pattern to control the trim rate of the first pattern during the trimming process.


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