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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8952521 B1

PDFFull Text
Date of Patent:
Feb. 10, 2015

Filed:

Jan. 08, 2013

Semiconductor packages with integrated antenna and method of forming thereof

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Maciej Wojnowski, Munich, DE;

Walter Hartner, Bad Abbach, DE;

Ottmar Geitner, Pentling, DE;

Gottfried Beer, Nittendorf, DE;

Klaus Pressel, Regensburg, DE;

Mehran Pour Mousavi, Munich, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Slater & Matsil, L.L.P.

Primary Examiner:

Jasmine Clark

Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/66 (2006.01); H01L 21/768 (2006.01); H01L 23/498 (2006.01); H01Q 1/22 (2006.01); H01Q 9/04 (2006.01); H01Q 9/16 (2006.01); H01Q 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 21/76885 (2013.01); H01L 21/76802 (2013.01); H01L 23/49827 (2013.01); H01Q 1/2283 (2013.01); H01Q 9/0407 (2013.01); H01Q 9/16 (2013.01); H01Q 23/00 (2013.01); H01L 2924/0002 (2013.01); H01L 23/3128 (2013.01);
Abstract

In one embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A chip is disposed in the substrate. The chip includes a plurality of contact pads at the first major surface. A first antenna structure is disposed at the first major surface. A reflector is disposed at the second major surface.

Find Patent Forward Citations

Wojnowski, Maciej. (2015). Semiconductor packages with integrated antenna and method of forming thereof (U.S. Patent No. 8952521). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8952521

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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