The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2015

Filed:

Mar. 13, 2013
Applicant:

National Taiwan University, Taipei, TW;

Inventors:

Ching-Fuh Lin, Taipei, TW;

Kuei-Yu Cian, Taipei, TW;

Shao-Hsuan Kao, Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/312 (2006.01); C08F 2/48 (2006.01); H01L 51/00 (2006.01); H01L 51/42 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0003 (2013.01); H01L 51/0035 (2013.01); H01L 51/0047 (2013.01); H01L 51/424 (2013.01);
Abstract

The present invention relates to a method for fabricating an interlayer, and particularly relates to a method for fabricating an interlayer PCBM which is difficult to be dissolved in organic solvents. The solubility of the interlayer (PCBM) in organic solvents is decreased by polymerization of the interlayer (PCBM). Therefore, the thickness of the interlayer (PCBM) can be efficiently controlled, and the yield rate and efficiency of photoelectric devices can be improved.


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