The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2015
Filed:
May. 31, 2012
Applicants:
Gopi Krishnan, Chandler, AZ (US);
Mingjie Xu, Chandler, AZ (US);
Edvin Cetegen, Chandler, AZ (US);
Sung-won Moon, Phoenix, AZ (US);
Inventors:
Gopi Krishnan, Chandler, AZ (US);
Mingjie Xu, Chandler, AZ (US);
Edvin Cetegen, Chandler, AZ (US);
Sung-Won Moon, Phoenix, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 23/34 (2006.01); H01L 23/373 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 23/3737 (2013.01); H01L 23/42 (2013.01); H01L 2924/0002 (2013.01);
Abstract
An extended preform of a thermal interface material (TIM) is formed between a heat spreader and a die on a substrate. The preform has an extension beyond a footprint of the die. The preform is cured. A bleed out of the TIM is controlled by the extension upon curing of the preform.