The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2015
Filed:
Aug. 09, 2013
Amkor Technology, Inc., Chandler, AZ (US);
Sung Kyu Kim, Seoul, KR;
Jin Young Kim, Seoul, KR;
Yoon Joo Kim, Seoul, KR;
Jin Han Kim, Gyeonggi-do, KR;
Seung Jae Lee, Gyeonggi-do, KR;
Se Woong Cha, Gyeonggi-do, KR;
Jae Hun Bae, Gyeongsangbuk-do, KR;
Dong Jin Kim, Jeollanam-do, KR;
Won Myoung Ki, Gyeonggi-do, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A wafer level fan-out package with a fiducial die is disclosed and may include a semiconductor die and a transparent fiducial die both encapsulated in a molding compound resin, passivation layers on an upper surface and a lower surface of the molding compound resin except where redistribution layers are formed on upper and lower surfaces of the molding compound resin, and a metal pattern on a lower surface of the transparent fiducial die that is visible through an exposed upper surface of the transparent fiducial die. The pattern may comprise a standard coordinate for forming a through mold via utilizing laser drilling.