The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2015

Filed:

Jun. 13, 2011
Applicants:

Kotaro Kubo, Saitama, JP;

Yukio Hosaka, Tsu, JP;

Takahiro Okamoto, Yokkaichi, JP;

Inventors:

Kotaro Kubo, Saitama, JP;

Yukio Hosaka, Tsu, JP;

Takahiro Okamoto, Yokkaichi, JP;

Assignee:

JSR Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 (2006.01); B24B 37/26 (2012.01); B24B 37/24 (2012.01); H01L 21/3105 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
B24B 37/26 (2013.01); B24B 37/24 (2013.01); H01L 21/31053 (2013.01); H01L 21/3212 (2013.01);
Abstract

A chemical mechanical polishing pad includes a polishing layer, a recess being formed in a polishing surface of the polishing layer, the polishing layer including a surface layer that forms at least an inner side of the recess, and a ratio (D1/D2) of an average opening ratio D1(%) to an average opening ratio D2(%) being 0.01 to 0.5, the average opening ratio D1 being an average opening ratio of the inner side of the recess when the polishing layer has been immersed in water at 23° C. for 1 hour, and the average opening ratio D2 being an average opening ratio of a cross section of the polishing layer that does not intersect the surface layer when the cross section has been immersed in water at 23° C. for 1 hour.


Find Patent Forward Citations

Loading…