The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2015
Filed:
Jun. 20, 2013
International Business Machines Corporation, Armonk, NY (US);
Jeanne P. Bickford, Essex Juntion, VT (US);
Nazmul Habib, South Burlington, VT (US);
Baozhen Li, South Burlington, VT (US);
Pascal A. Nsame, Essex Junction, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Systems and methods for semiconductor device reliability qualification during semiconductor device design. A method is provided that includes defining performance process window bins for a performance window. The method further includes determining at least one failure mechanism for each bin assignment. The method further includes generating different reliability models when the at least one failure mechanism is a function of the process window, and generating common reliability models when the at least one failure mechanism is not the function of the process window. The method further includes identifying at least one risk factor for each bin assignment, and generating aggregate models using a manufacturing line distribution. The method further includes determining a fail rate by bin and optimizing a line center to minimize product fail rate. The method further includes determining a fail rate by bin and scrapping production as a function of a manufacturing line excursion event.