The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2015
Filed:
Jun. 14, 2013
Wei-sheng Lei, San Jose, CA (US);
Brad Eaton, Menlo Park, CA (US);
Aparna Iyer, Sunnyvale, CA (US);
Saravjeet Singh, Santa Clara, CA (US);
Todd Egan, Fremont, CA (US);
Ajay Kumar, Cupertino, CA (US);
Seshadri Ramaswami, Saratoga, CA (US);
Wei-Sheng Lei, San Jose, CA (US);
Brad Eaton, Menlo Park, CA (US);
Aparna Iyer, Sunnyvale, CA (US);
Saravjeet Singh, Santa Clara, CA (US);
Todd Egan, Fremont, CA (US);
Ajay Kumar, Cupertino, CA (US);
Seshadri Ramaswami, Saratoga, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Methods of dicing semiconductor wafers, and transporting singulated die, are described. In an example, a method of dicing a wafer having a plurality of integrated circuits thereon involves dicing the wafer into a plurality of singulated dies disposed above a dicing tape. The method also involves forming a water soluble material layer over and between the plurality of singulated dies, above the dicing tape.