The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2015
Filed:
Aug. 08, 2011
Applicants:
Luke G. England, Boise, ID (US);
Paul A. Silvestri, Merdian, ID (US);
Michel Koopmans, Boise, ID (US);
Inventors:
Luke G. England, Boise, ID (US);
Paul A. Silvestri, Merdian, ID (US);
Michel Koopmans, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 29/10 (2006.01); H01L 23/544 (2006.01); H01L 25/00 (2006.01); H01L 25/18 (2006.01); H01L 25/065 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 21/66 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/568 (2013.01); H01L 2221/6834 (2013.01); H01L 23/544 (2013.01); H01L 25/50 (2013.01); H01L 2225/06541 (2013.01); H01L 21/6863 (2013.01); H01L 2221/68327 (2013.01); H01L 21/6835 (2013.01); H01L 22/32 (2013.01); H01L 25/18 (2013.01); H01L 2224/16145 (2013.01); H01L 25/0657 (2013.01); H01L 23/3121 (2013.01); H01L 23/3107 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06596 (2013.01); H01L 2223/54433 (2013.01);
Abstract
Methods of fabricating multi-die assemblies including a base semiconductor die bearing a peripherally encapsulated stack of semiconductor dice of lesser lateral dimensions, the dice vertically connected by conductive elements between the dice, resulting assemblies, and semiconductor devices comprising such assemblies.