The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2015

Filed:

Aug. 31, 2011
Applicants:

Takashi Tanaka, Yamanashi, JP;

Yusuke Saito, Yamanashi, JP;

Mitsuaki Iwashita, Yamanashi, JP;

Inventors:

Takashi Tanaka, Yamanashi, JP;

Yusuke Saito, Yamanashi, JP;

Mitsuaki Iwashita, Yamanashi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/67 (2006.01); C23C 18/16 (2006.01); H01L 21/288 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6723 (2013.01); C23C 18/1675 (2013.01); C23C 18/1676 (2013.01); C23C 18/168 (2013.01); H01L 21/288 (2013.01);
Abstract

A liquid treatment apparatus of continuously performing a plating process on multiple substrates includes a temperature controlling container for accommodating a plating liquid; a temperature controller for controlling a temperature of the plating liquid in the temperature controlling container; a holding unit for holding the substrates one by one at a preset position; a nozzle having a supply hole through which the temperature-controlled plating liquid in the temperature controlling container is discharged to a processing surface of the substrate; a pushing unit for pushing the temperature-controlled plating liquid in the temperature controlling container toward the supply hole of the nozzle; and a supply control unit for controlling a timing when the plating liquid is pushed by the pushing unit. The temperature controller controls the temperature of the plating liquid in the temperature controlling container based on the timing when the plating liquid is pushed by the pushing unit.


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