The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2015
Filed:
Dec. 19, 2013
Applicant:
Intermolecular, Inc., San Jose, CA (US);
Inventors:
Sandip Niyogi, San Jose, CA (US);
Chi-l Lang, Cupertino, CA (US);
Assignee:
Intermolecular, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/768 (2006.01); C23C 14/04 (2006.01); C23C 14/06 (2006.01); C23C 14/18 (2006.01); C23C 14/58 (2006.01); H01L 21/3205 (2006.01); H01L 23/532 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76846 (2013.01); C23C 14/042 (2013.01); C23C 14/0605 (2013.01); C23C 14/185 (2013.01); C23C 14/5806 (2013.01); H01L 21/32051 (2013.01); H01L 23/53238 (2013.01); H01L 21/76855 (2013.01); H01L 21/76867 (2013.01); H01L 21/76871 (2013.01); H01L 21/02422 (2013.01); H01L 21/02527 (2013.01); H01L 21/02672 (2013.01); H01L 23/53276 (2013.01); H01L 21/76823 (2013.01); H01L 21/0243 (2013.01); H01L 2924/0002 (2013.01);
Abstract
Embodiments described herein provide interconnect barrier layers and methods for forming such barriers. A dielectric body having a trench formed in a surface thereof is provided. A first layer is formed above the dielectric body within the trench. The first layer includes amorphous carbon. A second layer is formed above the first layer. The second layer includes a metal. The dielectric body, the first layer, and the second layer are heated to convert at least some of the amorphous carbon to graphene.