The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2015

Filed:

Nov. 23, 2011
Applicants:

Masayuki Nakanishi, Tokyo, JP;

Masaya Seki, Tokyo, JP;

Kenji Kodera, Kanagawa, JP;

Inventors:

Masayuki Nakanishi, Tokyo, JP;

Masaya Seki, Tokyo, JP;

Kenji Kodera, Kanagawa, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 1/00 (2006.01); B24B 9/06 (2006.01); B24B 21/00 (2006.01); B24B 37/02 (2012.01);
U.S. Cl.
CPC ...
B24B 9/065 (2013.01); B24B 21/002 (2013.01); B24B 37/02 (2013.01);
Abstract

A method of polishing a peripheral portion of a substrate is provided. This method includes: causing sliding contact between the peripheral portion of the substrate and a polishing tape; and supplying a polishing liquid onto the polishing tape contacting the peripheral portion of the substrate. The polishing tape includes a base tape and a fixed abrasive formed on the base tape, and the polishing liquid is an alkaline polishing liquid containing an alkaline chemical and an additive including molecules that cause steric hindrance.


Find Patent Forward Citations

Loading…