The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2015

Filed:

Aug. 26, 2011
Applicants:

Michimasa Takahashi, Ogaki, JP;

Masakazu Aoyama, Ogaki, JP;

Inventors:

Michimasa Takahashi, Ogaki, JP;

Masakazu Aoyama, Ogaki, JP;

Assignee:

Ibiden Co., Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01); H05K 3/00 (2006.01); H01L 23/02 (2006.01); H05K 1/00 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4691 (2013.01); H05K 1/0218 (2013.01); H05K 3/0035 (2013.01); H05K 3/4652 (2013.01); H05K 3/4664 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/09127 (2013.01); H05K 2201/09509 (2013.01);
Abstract

A method of manufacturing a flex-rigid wiring board includes disposing a non-flexible substrate and a flexible board side by side in the horizontal direction of the substrate and board such that an end of the substrate is positioned adjacent to an end of the board and forms boundary between the board and the substrate with respect to the end of the board, covering the boundary between the board and the substrate with an insulating layer such that the insulating layer is positioned on the board and the substrate across the boundary, forming a second conductor pattern on the insulating layer, forming a via hole which passes through the insulating layer and reaches a first conductor pattern of the board, and plating the via hole such that a via conductor connecting the first and second patterns. The flexible board includes a flexible substrate and the first pattern formed over the substrate.


Find Patent Forward Citations

Takahashi, Michimasa. (2015). Flex-rigid wiring board and method of manufacturing the same (U.S. Patent No. 8925194). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8925194

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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