The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Jul. 31, 2008
Peng Wang Low, Singapore, SG;
Leng Cher Kuah, Singapore, SG;
Hong Wan NG, Singapore, SG;
Seng Kim YE, Singapore, SG;
Chye Lin Toh, Singapore, SG;
Peng Wang Low, Singapore, SG;
Leng Cher Kuah, Singapore, SG;
Hong Wan Ng, Singapore, SG;
Seng Kim Ye, Singapore, SG;
Chye Lin Toh, Singapore, SG;
Micron Technology, Inc., Boise, ID (US);
Abstract
Several embodiments of stacked-die microelectronic packages with small footprints and associated methods of manufacturing are disclosed herein. In one embodiment, the package includes a substrate, a first die carried by the substrate, and a second die between the first die and the substrate. The first die has a first footprint, and the second die has a second footprint that is smaller than the first footprint of the first die. The package further includes an adhesive having a first portion adjacent to a second portion. The first portion is between the first die and the second die, and the second portion being between the first die and the substrate.