The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2014

Filed:

Mar. 08, 2013
Applicant:

Fujitsu Semiconductor Limited, Kanagawa, JP;

Inventors:

Tamotsu Owada, Yokohama, JP;

Hikaru Ohira, Kuwana, JP;

Hirosato Ochimizu, Kuwana, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/82 (2006.01); H01L 21/02 (2006.01); H01L 29/06 (2006.01); H01L 21/304 (2006.01); H01L 25/065 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02107 (2013.01); H01L 29/0603 (2013.01); H01L 21/02118 (2013.01); H01L 21/02282 (2013.01); H01L 21/02318 (2013.01); H01L 21/02348 (2013.01); H01L 21/02351 (2013.01); H01L 21/304 (2013.01); H01L 25/0657 (2013.01); H01L 21/76898 (2013.01); H01L 21/76801 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/15311 (2013.01); H01L 23/5329 (2013.01); Y10S 438/958 (2013.01);
Abstract

A method of manufacturing a semiconductor device includes: forming a first electrode on a first semiconductor substrate; coating the semiconductor substrate with an insulating material having a first viscosity at a first temperature, having a second viscosity lower than the first viscosity at a second temperature higher than the first temperature, and having a third viscosity higher than the second viscosity at a third temperature higher than the second temperature; and forming a first insulating film by curing the insulating material. In this method, the forming the first insulating film includes: bringing the insulating material to the second viscosity by heating the insulating material under a first condition; and bringing the insulating material to the third viscosity by heating the insulating material under a second condition. The first condition and the second condition are different in their temperature rising rate.


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