The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2014

Filed:

Aug. 23, 2011
Applicants:

Akira Miyata, Koshi, JP;

Kenichirou Matsuyama, Koshi, JP;

Kunie Ogata, Koshi, JP;

Inventors:

Akira Miyata, Koshi, JP;

Kenichirou Matsuyama, Koshi, JP;

Kunie Ogata, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67126 (2013.01); B05D 5/12 (2013.01); H01L 21/6715 (2013.01); H01L 21/67225 (2013.01); H01L 21/6723 (2013.01);
Abstract

Provided is a substrate processing apparatus in which after a module is disabled, a substrate is provided to a carry-in module capable of placing the wafers most rapidly in the plurality of unit blocks and the substrates are sequentially transported to the module group by the transportation means to be delivered to the carry-out module according to a providing sequence of the substrate to the carry-in module in each of the plurality of unit blocks. In particular, the substrates are extracted from the carry-out module according to a providing sequence of the substrate to the carry-in module and transported to a rear module or a substrate placing part. Thereafter, the substrates are transported to the rear module from the carry-out module or the substrate placing part according to a predetermined sequence in which the substrate is provided to the carry-in module in a normal state.


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