The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2014

Filed:

May. 10, 2013
Applicants:

Intermolecular Inc., San Jose, CA (US);

Kabushiki Kaisha Toshiba, Tokyo, JP;

Sandisk 3d Llc, Milpitas, CA (US);

Inventors:

Yun Wang, San Jose, CA (US);

Vidyut Gopal, Sunnyvale, CA (US);

Chien-Lan Hsueh, Campbell, CA (US);

Assignees:

Intermolecular, Inc., San Jose, CA (US);

Kabushiki Kaisha Toshiba, Tokyo, JP;

SanDisk 3D LLC, Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 45/00 (2006.01); G11C 13/00 (2006.01);
U.S. Cl.
CPC ...
H01L 45/1641 (2013.01); H01L 45/14 (2013.01); H01L 45/1608 (2013.01); G11C 13/0002 (2013.01); G11C 13/0007 (2013.01); H01L 45/146 (2013.01); G11C 2213/51 (2013.01);
Abstract

Provided are resistive random access memory (ReRAM) cells and methods of fabricating thereof. A stack including a defect source layer, a defect blocking layer, and a defect acceptor layer disposed between the defect source layer and the defect blocking layer may be subjected to annealing. During the annealing, defects are transferred in a controllable manner from the defect source layer to the defect acceptor layer. At the same time, the defects are not transferred into the defect blocking layer thereby creating a lowest concentration zone within the defect acceptor layer. This zone is responsible for resistive switching. The precise control over the size of the zone and the defect concentration within the zone allows substantially improvement of resistive switching characteristics of the ReRAM cell. In some embodiments, the defect source layer includes aluminum oxynitride, the defect blocking layer includes titanium nitride, and the defect acceptor layer includes aluminum oxide.


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