The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2014

Filed:

Jun. 23, 2012
Applicants:

Matthew E. Colburn, Yorktown Heights, NY (US);

Satya V. Nitta, Yorktown Heights, NY (US);

Sampath Purushothaman, Yorktown Heights, NY (US);

Charles Black, Yorktown Heights, NY (US);

Kathryn Guarini, Yorktown Heights, NY (US);

Inventors:

Matthew E. Colburn, Yorktown Heights, NY (US);

Satya V. Nitta, Yorktown Heights, NY (US);

Sampath Purushothaman, Yorktown Heights, NY (US);

Charles Black, Yorktown Heights, NY (US);

Kathryn Guarini, Yorktown Heights, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/311 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31144 (2013.01); H01L 21/7682 (2013.01);
Abstract

A method for forming an interconnect structure with nanocolumnar intermetal dielectric is described involving the construction of an interconnect structure using a solid dielectric, and introducing a regular array of vertically aligned nanoscale pores through stencil formation and etching to form a hole array and subsequently pinching off the tops of the hole array with a cap dielectric. Variations of the method and means to construct a multilevel nanocolumnar interconnect structure are also described.


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