The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2014

Filed:

Dec. 31, 2012
Applicants:

Stmicroelectronics, Inc., Coppell, TX (US);

International Business Machines Corporation, Armonk, NY (US);

Inventors:

John H. Zhang, Fishkill, NY (US);

Lawrence A. Clevenger, LaGrangeville, NY (US);

Carl Radens, LaGrangeville, NY (US);

Yiheng Xu, Hopewell Junction, NY (US);

Walter Kleemeier, Fishkill, NY (US);

Cindy Goldberg, Cold Spring, NY (US);

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 21/44 (2006.01); H01L 21/768 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76877 (2013.01); H01L 23/5384 (2013.01);
Abstract

Metal interconnections are formed in an integrated by combining damascene processes and subtractive metal etching. A wide trench is formed in a dielectric layer. A conductive material is deposited in the wide trench. Trenches are etched in the conductive material to delineate a plurality of metal plugs each contacting a respective metal track exposed by the wide trench.


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