The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2014

Filed:

Mar. 15, 2013
Applicants:

Qing Yang, Singapore, SG;

Shyue Fong Quek, Singapore, SG;

Gek Soon Chua, Singapore, SG;

Yee Mei Foong, Singapore, SG;

Dong Qing Zhang, Ballston Spa, NY (US);

Yun Tang, Singapore, SG;

Inventors:

Qing Yang, Singapore, SG;

Shyue Fong Quek, Singapore, SG;

Gek Soon Chua, Singapore, SG;

Yee Mei Foong, Singapore, SG;

Dong Qing Zhang, Ballston Spa, NY (US);

Yun Tang, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5036 (2013.01);
Abstract

An approach for methodology, and an associated apparatus, enabling a simulation process to check integrity of the design and predict a manufacturability of a resulting circuit that accounts for process latitude without a long turnaround time and/or a highly skilled engineer is disclosed. Embodiments include: determining first and second features of an IC design; determining a thickness of a resist layer of the IC design based on an aerial image of the IC design; determining a threshold value according to the thickness; and comparing the threshold value to a separation distance between the first and second features.


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