The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2014
Filed:
Nov. 01, 2013
Disco Corporation, Tokyo, JP;
Kazuma Sekiya, Tokyo, JP;
Hiroshi Onodera, Tokyo, JP;
Disco Corporation, Tokyo, JP;
Abstract
A wafer attaching method of attaching a wafer having a warp to a sheet includes a wafer warp detecting step of detecting a surface shape of the wafer, a wafer positioning step of applying a photocuring liquid resin to the sheet and positioning the wafer so that a predetermined surface of the wafer corresponding to attaching conditions preset in a resin bonding apparatus is opposed to the sheet and the liquid resin according to the preset attaching conditions and the surface shape detected above, and a wafer attaching step of pressing the wafer against the liquid resin to thereby spread the liquid resin over the entire area where the wafer and the sheet are superimposed, next removing the pressure applied to the wafer, and next applying light to the liquid resin to cure the liquid resin, thereby attaching the predetermined surface of the wafer to the sheet.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile