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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8895222 B1

PDFFull Text
Date of Patent:
Nov. 25, 2014

Filed:

Mar. 23, 2010

Actinic ray-sensitive or radiation-sensitive resin composition and resist film and pattern forming method using the composition

Applicants:

Tomotaka Tsuchimura, Shizuoka, JP;

Hidenori Takahashi, Shizuoka, JP;

Takayuki Ito, Shizuoka, JP;

Takeshi Inasaki, Shizuoka, JP;

Shohei Kataoka, Shizuoka, JP;

Inventors:

Tomotaka Tsuchimura, Shizuoka, JP;

Hidenori Takahashi, Shizuoka, JP;

Takayuki Ito, Shizuoka, JP;

Takeshi Inasaki, Shizuoka, JP;

Shohei Kataoka, Shizuoka, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Anca Eoff

Int. Cl.
CPC ...
G03F 7/004 (2006.01); G03F 7/028 (2006.01); G03F 7/029 (2006.01); G03F 7/039 (2006.01); G03F 7/20 (2006.01); C08F 224/00 (2006.01);
U.S. Cl.
CPC ...
C08F 224/00 (2013.01); G03F 7/0045 (2013.01); G03F 7/0392 (2013.01); G03F 7/029 (2013.01); G03F 7/2037 (2013.01); Y10S 430/122 (2013.01);
Abstract

Provided is an actinic ray-sensitive or radiation-sensitive resin composition including (P) a resin which contains (A) a repeating unit having an ionic structure moiety capable of producing an acid anion on the side chain upon irradiation with an actinic ray or radiation, wherein a cation moiety of the ionic structure moiety has an acid-decomposable group or an alkali-decomposable group.

Find Patent Forward Citations

Tsuchimura, Tomotaka. (2014). Actinic ray-sensitive or radiation-sensitive resin composition and resist film and pattern forming method using the composition (U.S. Patent No. 8895222). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8895222

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