The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2014

Filed:

Apr. 25, 2012
Applicants:

DO Hyung Kim, Gyeonggi-do, KR;

Dae Byoung Kang, Seoul, KR;

Seung Chul Han, Gyeonggi-do, KR;

Inventors:

Do Hyung Kim, Gyeonggi-do, KR;

Dae Byoung Kang, Seoul, KR;

Seung Chul Han, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/48 (2006.01); H01L 29/40 (2006.01); H01L 23/538 (2006.01); H01L 27/146 (2006.01); H01L 21/50 (2006.01); H01L 21/48 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/3128 (2013.01); H01L 2924/01079 (2013.01); H01L 2225/0651 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/48227 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06565 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15173 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06572 (2013.03); H01L 2225/06541 (2013.01); H01L 24/48 (2013.01); H01L 2924/15311 (2013.01); H01L 2224/32145 (2013.01); H01L 2225/06513 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 2224/13009 (2013.01);
Abstract

A semiconductor device entirely having a small height, which performs a fan-out operation for input/output signals and forms a short electrical path is provided. The semiconductor device includes a first semiconductor die having a first surface, a second surface opposed to the first surface, a third surface connecting the first and second surfaces to each other, a first bond pad disposed on the first surface, and a first through electrode passing between the first surface and second surface and electrically connected to the first bond pad. A first redistribution part is disposed under the second surface and includes a first redistribution layer electrically connected to the first through electrode. A second redistribution part is disposed over the first surface and includes a second redistribution layer electrically connected to the first bond pad.


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