The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2014

Filed:

Feb. 22, 2012
Applicants:

Takanobu Takeda, Annaka, JP;

Kyoko Soga, Annaka, JP;

Satoshi Asai, Annaka, JP;

Inventors:

Takanobu Takeda, Annaka, JP;

Kyoko Soga, Annaka, JP;

Satoshi Asai, Annaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 77/60 (2006.01); C08G 77/14 (2006.01); C09J 183/14 (2006.01); C09J 183/16 (2006.01); C08G 77/52 (2006.01); C09J 183/06 (2006.01);
U.S. Cl.
CPC ...
C09J 183/06 (2013.01); C08G 77/14 (2013.01); C09J 183/14 (2013.01); C09J 183/16 (2013.01); C08G 77/52 (2013.01);
Abstract

An adhesive composition useful in bonding a protective glass with a silicon substrate of a semiconductor device contains (A) an epoxy-containing high-molecular compound and (B) a solvent. The compound (A) has a weight average molecular weight of 3,000 to 500,000 and repeating units represented by the following formula (1):


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