The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2014
Filed:
Jun. 28, 2013
Stmicroelectronics, Inc., Coppell, TX (US);
International Business Machines Corporation, Armonk, NY (US);
John H. Zhang, Fishkill, NY (US);
Lawrence A. Clevenger, Lagrangeville, NY (US);
Carl Radens, Lagrangeville, NY (US);
Yiheng Xu, Hopewell Junction, NY (US);
Edem Wornyo, Danbury, CT (US);
STMicroelectronics, Inc., Coppell, TX (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An integrated circuit die includes a semiconductor substrate, a first dielectric layer on the substrate, and a second dielectric layer on the first dielectric layer. Trenches are formed in the first and second dielectric layers. Metal interconnection tracks are formed on sidewalls of the trench on the exposed portions of the second dielectric layer.