The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2014
Filed:
Jul. 17, 2008
Applicants:
Yuji Kawamata, Tochigi, JP;
Minoru Ueshima, Matsudo, JP;
Tomu Tamura, Kawanishi, JP;
Kazuhiro Matsushita, Hamamatsu, JP;
Masashi Sakamoto, Mino, JP;
Inventors:
Yuji Kawamata, Tochigi, JP;
Minoru Ueshima, Matsudo, JP;
Tomu Tamura, Kawanishi, JP;
Kazuhiro Matsushita, Hamamatsu, JP;
Masashi Sakamoto, Mino, JP;
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/34 (2006.01); C22C 13/00 (2006.01); B23K 35/26 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
C22C 13/00 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); H05K 3/3463 (2013.01);
Abstract
A lead-free solder alloy which can be used for soldering of vehicle-mounted electronic circuits and which exhibits high reliability is provided. The alloy consists essentially of Ag: 2.8-4 mass %, In: 3-5.5 mass %, Cu: 0.5-1.1 mass %, if necessary Bi: 0.5-3 mass %, and a remainder of Sn. In is at least partially in solid solution in the Sn matrix.