The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2014
Filed:
Jun. 10, 2005
Applicants:
Ryoichi Kurata, Tochigi, JP;
Daisuke Soma, Tochigi, JP;
Hiroshi Okada, Moka, JP;
Inventors:
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); C22C 13/00 (2006.01); B23K 35/26 (2006.01); H05K 3/34 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); H05K 3/3463 (2013.01); H05K 3/244 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/072 (2013.01);
Abstract
When electrodes of a BGA plated by electroless Ni plating are soldered with solder balls of a lead-free solder, peeling of soldered joints readily takes place under an external impact. When a BGA electrode plated by electroless Ni plating is soldered with a lead-free solder to which 0.03-0.1 mass percent of P is added, the growth of brittle SnNi intermetallic compounds formed on the portion being soldered and a P layer on the electroless Ni plating surface is suppressed, resulting in an increased bonding strength.