The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2014

Filed:

Jun. 04, 2013
Applicants:

Arpan Chakraborty, Goleta, CA (US);

Benjamin A. Haskell, Carlsbad, CA (US);

Stacia Keller, Santa Barbara, CA (US);

James S. Speck, Goleta, CA (US);

Steven P. Denbaars, Goleta, CA (US);

Shuji Nakamura, Santa Barbara, CA (US);

Umesh K. Mishra, Montecito, CA (US);

Inventors:

Arpan Chakraborty, Goleta, CA (US);

Benjamin A. Haskell, Carlsbad, CA (US);

Stacia Keller, Santa Barbara, CA (US);

James S. Speck, Goleta, CA (US);

Steven P. DenBaars, Goleta, CA (US);

Shuji Nakamura, Santa Barbara, CA (US);

Umesh K. Mishra, Montecito, CA (US);

Assignees:

The Regents of the University of California, Oakland, CA (US);

The Japan Science and Technology Agency, Kawaguchi, Saitama Prefecture, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/16 (2010.01); H01L 21/02 (2006.01); H01S 5/343 (2006.01); B82Y 20/00 (2011.01); H01L 33/00 (2010.01); C30B 29/40 (2006.01); C30B 25/02 (2006.01); H01L 33/06 (2010.01); H01S 5/32 (2006.01); H01S 5/02 (2006.01);
U.S. Cl.
CPC ...
H01L 33/06 (2013.01); H01S 2304/12 (2013.01); H01L 21/0237 (2013.01); H01S 5/34333 (2013.01); B82Y 20/00 (2013.01); H01L 21/02502 (2013.01); H01L 33/0075 (2013.01); H01L 21/02389 (2013.01); C30B 29/403 (2013.01); H01S 5/3202 (2013.01); C30B 25/02 (2013.01); H01L 21/02609 (2013.01); H01L 21/0254 (2013.01); H01L 21/02433 (2013.01); H01S 5/0213 (2013.01); H01L 21/02458 (2013.01); H01S 2304/04 (2013.01);
Abstract

A method for the fabrication of nonpolar indium gallium nitride (InGaN) films as well as nonpolar InGaN-containing device structures using metalorganic chemical vapor deposition (MOVCD). The method is used to fabricate nonpolar InGaN/GaN violet and near-ultraviolet light emitting diodes and laser diodes.


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