The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2014
Filed:
May. 28, 2010
Shuhei Matsuda, Tokyo, JP;
Tetsuro Iwashita, Tokyo, JP;
Ryuichi Tanimoto, Tokyo, JP;
Takeru Takushima, Tokyo, JP;
Takeo Katoh, Tokyo, JP;
Shuhei Matsuda, Tokyo, JP;
Tetsuro Iwashita, Tokyo, JP;
Ryuichi Tanimoto, Tokyo, JP;
Takeru Takushima, Tokyo, JP;
Takeo Katoh, Tokyo, JP;
Sumco Corporation, Tokyo, JP;
Abstract
This invention is to provide a method of polishing a silicon wafer wherein a high flatness can be attained likewise the conventional polishing method and further the occurrence of defects due to the remaining of substances included in the polishing solution on the surface of the wafer can be suppressed as well as a polished silicon wafer. The method of polishing a silicon wafer by supplying a polishing solution containing abrasive grains onto a surface of a polishing pad and then relatively sliding the polishing pad to a silicon wafer to polish the surface of the silicon wafer, is characterized in that the number of abrasive grains included in the polishing solution is controlled to not more than 5×10grains/cm.