The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2014

Filed:

Jul. 07, 2009
Applicants:

Yasuhiko Endo, Tokyo, JP;

Fumio Kuriyama, Tokyo, JP;

Masaaki Kimura, Tokyo, JP;

Inventors:

Yasuhiko Endo, Tokyo, JP;

Fumio Kuriyama, Tokyo, JP;

Masaaki Kimura, Tokyo, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 5/00 (2006.01); C25D 17/00 (2006.01); C25D 17/12 (2006.01);
U.S. Cl.
CPC ...
C25D 17/00 (2013.01); C25D 17/001 (2013.01); C25D 5/006 (2013.01); C25D 17/12 (2013.01);
Abstract

A magnetic film plating apparatus employs a dip method that allows relatively good escape of bubbles and does not require a wide footprint and, even when a ferromagnetic material is used for an anode, can form a magnetic film on a substrate surface while minimizing the influence of the anode on the uniformity of magnetic anisotropy in the magnetic film. The magnetic film plating apparatus includes a plating tank for holding a plating solution, an anode vertically disposed in the plating tank at a position to be immersed in the plating solution, a substrate holder for holding a substrate W and positioning the substrate W opposite the anode, and a magnetic field generator, disposed outside the plating tank, for generating a magnetic field around the substrate W held by the substrate holder and positioned opposite the anode.


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