The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2014

Filed:

Aug. 24, 2011
Applicants:

Ching-hai Yang, Taipei, TW;

Shang-sheng LI, Zhubei, TW;

Inventors:

Ching-Hai Yang, Taipei, TW;

Shang-Sheng Li, Zhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03B 27/32 (2006.01); B05B 17/04 (2006.01); H01L 21/67 (2006.01); B05B 15/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6715 (2013.01); B05B 15/02 (2013.01); H01L 21/67051 (2013.01); B05B 15/0258 (2013.01);
Abstract

The present disclosure provides an apparatus for fabricating a semiconductor device. The apparatus includes a lithography tool. The lithography tool includes: a first nozzle configured to dispense a developer solution to a wafer; a second nozzle configured to dispense a cleaning solution to the first nozzle; and a controller configured to operate the second nozzle according to a predefined program. The present disclosure also provides a method of fabricating a semiconductor device. The method includes performing a developing process, wherein the performing the developing process includes dispensing a developer solution on a wafer using a first nozzle. The method also includes cleaning the first nozzle with a second nozzle, wherein the cleaning the first nozzle is executed according to one of a plurality of program recipes that each specify a sequence and a duration for which the first nozzle and the second nozzle are to be selectively activated.


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